Patterning of hafnia and titania via gas-phase soft lithography combined with atomic layer deposition
Abstract(#br)Novel titania and hafnia structures on top of silica wafer were produced using atomic layer deposition through the accessible pores created by a patterned polydimethylsiloxane (PDMS) stamp in conformal contact. Typically, the processing temperature was in the range of 125\u003cce:hsp sp=\"0.25\"/\u003e°C in order to avoid damaging the stamp and also to create an amorphous metal oxide deposit. Interestingly, the deposit formation tended to be dominated by condensation of the metal oxide precursor and water in the vicinity of the contact edges of the stamp and substrate.