可拉伸包装

可拉伸电子封装用局部变刚度可拉伸基材的界面粘接增强工艺可拉伸封装用局部变刚度可拉伸基材；可拉伸基材；PDMS；FPCB；粘接硅酮胶黏剂。为了研制一种软PDMS /硬PDMS / FPCB结构的局部变刚度可拉伸基材，该基材由两个不同刚度的聚二甲基硅氧烷( PDMS )部件和柔性印刷电路板组成，采用丙烯酸酯-硅酮双面胶带将FPCB粘接到PDMS上，并对PDMS / FPCB的界面粘接性能进行了评价。采用双面胶带的有机硅胶粘剂将FPCB粘接到完全固化的PDMS上，其拉伸强度为259 kPa，拉伸过程中出现分层现象。相反，采用有机硅胶将FPCB与PDMS在$60^{\\circ}C$下部分固化15 ~ 20 min，然后在$60^{\\circ}C$下完全固化12 h的粘接工艺，拉伸强度显著提高，为10.07 ~ 10.94 k Pa。采用上述粘接工艺，在FPCB与丙烯酸-硅氧烷双面胶带粘接界面处观察到拉伸试验中的分层现象。

Elastic Modulus of Locally Stiffness-variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging ApplicationsStretchable packaging;stretchable substrate;PDMS;stiffness;elastic modulus;In order to apply to stretchable electronics packaging, locally stiffness-variant stretchable substrates consisting of island structure were fabricated by combining two polydimethylsiloxane elastomers of different stiffnesses and their elastic moduli were characterized as a function of the width of the high-stiffness island.

Deformation Behavior of Locally Stiffness-variant Stretchable Substrates Consisting of the Island StructureStretchable packaging;stretchable substrate;PDMS;stiffness;elastic modulus;In order to develop stretchable substrate technology for stretchable devices, locally stiffness-variant stretchable substrates were processed with two polydimethylsiloxane elastomers of different stiffnesses and their deformation behavior was characterized.