透明

Abstract(#br)A method employing one kind of material both for the construction of rough morphology and the chemical modification is called self-modification by us, which has not been reported in fabricating superhydrophobic surfaces so far. In this paper, taking candle soot as an intermediate, we created rough, superhydrophilic and transparent surfaces on glass trough calcination of polydimethylsiloxane (PDMS) at 550\u003cce:hsp sp=\"0.25\"/\u003e°C.

Abstract(#br)We reported a novel, simple, modification-free process for the preparation of transparent superhydrophobic surfaces by calcining candle-soot-coated polydimethylsiloxane (PDMS) films. Though a calcination process, a candle soot template was gradually removed while robust fibrous and network structures were created on glass. Owing to these structures, the glass substrates were durable and highly transparent with an average transmittance (400–800\u003cce:hsp sp=\"0.25\"/\u003enm) of 89.50%, very closed to the bare glass slides (89.70%).

Transparent, hydrophobic hybrid films were deposited on glass substrate from solution containing hydroxyl-terminatedpolydimethylsiloxane (PDMS) and TiO2 sol by using a dip coating method. The effects of the film heat-treatment temperatureand PDMS/TiO2 component on surface properties of the hybrid films were investigated by water drop contact angle measurement,and by atomic force microscopy (AFM) and scanning electron microscope (SEM) analyses.

Transparent, hydrophobic hybrid films were deposited on glass substrate from solution containing hydroxyl-terminatedpolydimethylsiloxane (PDMS) and TiO2 sol by using a dip coating method. The effects of the film heat-treatment temperatureand PDMS/TiO2 component on surface properties of the hybrid films were investigated by water drop contact angle measurement,and by atomic force microscopy (AFM) and scanning electron microscope (SEM) analyses.

Fabrication of Superhydrophobic Film with Uniform Structures Using Two Step Lithography and Nanosilica CoatingTwo step lithography;Edge beads;Superhydrophobic;Transparent;Flexible;We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed.