Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core-Shell Structured Fillers and Silicone Polymers.
This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core-shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m\u003csup\u003e-1\u003c/sup\u003e K\u003csup\u003e-1\u003c/sup\u003e, and a -4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency.