有机硅丙烯酸嵌段共聚物

Enhanced Heat Resistance of Acrylic Pressure-Sensitive Adhesive by Incorporating Silicone Blocks Using Silicone-Based Macro-Azo-Initiator.

ty10086 提交于 周四, 08/26/2021 - 12:42
To improve the heat resistance of acrylic-based pressure-sensitive adhesive (PSA), silicone-block-containing acrylic PSAs (SPSAs) were synthesized using a polydimethylsiloxane (PDMS)-based macro-azo-initiator (MAI). To evaluate the heat resistance of the PSA films, the probe tack and 90° peel strength were measured at different temperatures. The acrylic PSA showed that its tack curves changed from balanced debonding at 25 °C to cohesive debonding at 50 °C and exhibited a sharp decrease.

采用有机硅基宏观偶氮引发剂,通过加入有机硅块增强丙烯酸酯压敏胶的耐热性

ty10086 提交于 周三, 08/25/2021 - 16:46
为了提高丙烯酸基压敏胶( PSA )的耐热性,采用聚二甲基硅氧烷( PDMS )基宏观偶氮引发剂( MAI )合成了含硅嵌段的丙烯酸PSAs ( SPSAs )。为了评价PSA薄膜的耐热性,在不同温度下测定了探针钉和90°剥离强度。丙烯酸PSA表明,其黏着曲线由25℃的平衡脱粘转变为50℃的黏聚脱粘,并呈现急剧降低的趋势。但在SPSA含20wt % MAI ( MAI20 )的情况下,平衡脱粘保持在75℃,其粘着值几乎不随温度变化。随着MAI含量的增加,SPSA中PDMS-与丙烯嵌段之间的微相分离导致25℃下的剥离强度降低,但剪切粘着破坏温度( SAFT )从41.3℃几乎线性增加到122.8℃。由于加入20wt %的有机硅-聚氨酯二甲基丙烯酸酯齐聚物和200 m J / cm2的紫外光照射剂量,MAI20在25℃时的90°剥离强度显著提高(原MAI20为548.3 vs . 322.4 gf / 25 mm )。通过剪切粘着破坏试验( SAFT )评估其在剪切应力作用下的耐热性,与未辐照试样相比,其破坏温度提高到177.3℃。