气泡模板法制备的rGO -石墨烯纳米片泡沫塑料封装在硅橡胶中用于电磁干扰屏蔽和高热导率

Introducing three-dimensional (3D) conductive network in polymer composites is a greatly potential way for acquiring desirable electromagnetic interference (EMI) shielding capacity to satisfy the requirements of next-generation mobile electronics devices. However, facile and scale production to achieve rational design of the microstructure of 3D conductive framework is still remain challenging. Here, we reported a facile foaming route to construct the bubble-templated 3D graphene network, which endow the polydimethylsiloxane (PDMS) rubber composites with excellent EMI-shielding effectiveness of ~86 dB at a thickness of 2 mm. The superior EMI-shielding property is ascribed to the abundant closed pore structures to reflect and absorb electromagnetic waves and high electrical conductivity from interconnected 3D graphene networks. Meanwhile, owing to the low filler loading content of only 18.1 wt%, the density of the obtained composite is just 1.1 g/cm 3 , which is about 200% lower than those of the commercial products with a similar EMI SE value. Moreover, this composites also have a high thermal conductivity of above 3 W/(m·K), showing great promise for applications of EMI shielding and efficient thermal management in aerospace, telecommunications, and mobile electronics devices.