基质力学通过人根尖乳头干细胞中的缝隙连接决定细胞与细胞的通讯

ty10086 提交于 周三, 08/25/2021 - 17:24
文章英文标题
Substrate mechanics dictate cell-cell communication by gap junctions in stem cells from human apical papilla
正文
摘要\n人们认识到,细胞与其物理微环境之间的相互作用在控制细胞行为甚至决定细胞命运方面起着根本的作用。细胞外基质( ECM )的任何物理性质的改变,如其地形、几何和刚度,都控制着这种相互作用。在本研究中,我们揭示了界面刚度介导的细胞-基质相互作用和细胞-细胞通信之间的强关联性,并从机械感知、机械传递和缝隙连接介导的细胞-细胞通信三个方面阐明了人根尖乳头干细胞的这一过程。我们首先制备了具有相同形貌和几何形状但刚度不同的聚二甲基硅氧烷( PDMS )基底,发现hSCAPs的细胞形态发生了积极的变化,以适应基底刚度的不同。我们还发现,hSCAPs分泌更多纤维连接蛋白以应对僵硬的底物。通过改变局灶黏附激酶( FAK )和paxillin的表达来改变局灶黏附斑块。FAK和paxillin结合连接蛋白43,因此改变了缝隙连接的形成。通过进行Lucifer黄转移实验,我们进一步证实了界面刚度通过缝隙连接隧道的改变介导了活的hSCAPs中的细胞-细胞通讯。细胞外刚度介导细胞-细胞间通讯的内在机制显示了细胞与其外界物理微环境相互作用的巨大影响,强调了微环境力学在器官发育和疾病中的重要性。\n意义声明\n生化因子可直接指导细胞增殖、迁移、分化、细胞周期和凋亡等细胞行为。同样,生物物物理因素也可以决定细胞在所有生物过程中的行为。在本研究中,我们通过阐明从细胞机械感应、机械传递到缝隙连接介导的细胞-细胞通信的全过程,揭示了细胞-基质相互作用与细胞-细胞通信之间的一种强关联。这个过程发生在一个细胞的集合中,而不是单个细胞的集合中。ECM诱导的细胞间通讯的生物物物理特性表明了微环境力学在器官发育和疾病中的重要性。这些发现应该在所有生物学领域,特别是在参与细胞与基质相互作用的生物材料-细胞/分子生物学方面引起极大兴趣。
文章内容(英文)
ABSTRACT(#br)It is recognized that the interaction between cells and their physical microenvironment plays a fundamental role in controlling cell behaviors and even in determining cell fate. Any change in the physical properties of the extracellular matrix (ECM), such as its topography, geometry, and stiffness, controls this interaction. In the current study, we revealed a potent interconnection between the cell-matrix interaction and cell-cell communication that is mediated by interface stiffness, and elucidated this process in stem cells from human apical papilla (hSCAPs) in terms of mechanosensing, mechanotransduction, and gap junction-mediated cell-cell communication. We first fabricated polydimethylsiloxane (PDMS) substrates with the same topography and geometry but different stiffnesses and found that the cell morphology of the hSCAPs actively changed to adapt to the difference in substrate stiffness. We also found that the hSCAPs secreted more fibronectin in response to the stiff substrate. The focal adhesion plaques were changed by altering the expression of focal adhesion kinase (FAK) and paxillin. The FAK and paxillin bound to connexin 43 and, as a result, altered the gap junction formation. By performing a Lucifer yellow transfer assay, we further confirmed that the interface stiffness mediated cell-cell communication in living hSCAPs through changes in gap junction tunnels. The intrinsic mechanism that mediated cell-cell communication by extracellular stiffness show the great influence of the interaction between cells and their external physical microenvironment and stress the importance of microenvironmental mechanics in organ development and diseases.(#br)Statement of Significance(#br)Biochemical factors could direct cell behaviors such as cell proliferation, migration, differentiation, cell cycling and apoptosis. Likewise, biophysical factors could also determine cell behaviors in all biological processes. In the current study, we revealed a potent interconnection between the cell-matrix interaction and cell-cell communication by elucidating the whole process from cell mechanosensing, mechanotransduction to gap junction-mediated cell-cell communication. This process occurs in a collective of cells but not in that of a single cell. Biophysical properties of ECM induced cell-to-cell communication indicates the importance of microenvironmental mechanics in organ development and diseases. These findings should be of great interest in all biological fields, especially in biomaterials - cell/molecular biology involved in the interactions between the cell and its matrix.
来源出处
Journal|[J]Acta BiomaterialiaVolume 107, 2020. PP 178-193
DOI
https://doi.org/10.1016/j.actbio.2020.02.032

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信息更新:

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备注说明:

美国道康宁道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品,包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合,中等粘度混合液的稠度与SAE 40机油相似。无论厚薄,混合液将固化成为具有韧性的透明弹性体,最适用于电子/电气方面的封装与灌封应用。 道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化,无放热现象,无需二次固化。固化过程完成后,可立即在-55~200℃的温度范围内使用。 产品特性:低毒性,在常规的工业操作中,无特别的注意事项; 无溶剂或固化副产物, 固化时不放热;无需特殊的通风条件,不会产生腐蚀;固化时,收缩量小; 固化后, 透明具有弹性;抗震与减缓机械震动;振动的传递性能小;元件可裸视检查与易修补性; 环保性能;低吸水性,良好的耐辐射性能;高真空状态下的低漏气性; 优异的电性能;较大温度范围内的稳定性, 抗解聚;在-55~200℃范围内,甚至在密闭状态下保持弹性与柔韧性,性能稳定; 阻燃性,UL可燃性分级为94 V-1,温度等级:130℃ 产品用途: 道康宁SYLGARD 184硅橡胶在电气/电子的封装与灌封方面有广泛的应用。