将3D打印件密封到聚二甲基硅氧烷上,用于制作微流控器件。

ty10086 提交于 周三, 08/25/2021 - 17:06
文章英文标题
Sealing 3D-printed parts to poly(dimethylsiloxane) for simple fabrication of Microfluidic devices.
文章内容(英文)
Microfluidics has revolutionized the fields of bioanalytical chemistry, cellular biology, and molecular biology. Advancements in microfluidic technologies, however, are often limited by labor, time, and resource-intensive fabrication methods, most commonly a form of photolithography. The advent of 3D printing has helped researchers fabricate proof-of-concept microfluidics more rapidly and at lower costs but suffers from poor resolution and tedious post-processing to remove uncured resin from enclosed channels. Additionally, custom resins and printers are often needed to create entirely enclosed channels, which increases cost and complexity of fabrication. In this work we demonstrate the ability to create microfluidic devices by covalently sealing 3D-printed parts with open-faced channels to polydimethylsiloxane (PDMS). Open-faced channels are easier to print than fully enclosed channels and can be printed using an inexpensive and commercially available stereolithography 3D printer and resin. The 3D-printed parts are sealed to PDMS, a common substrate used in traditional microfluidic fabrication, using two different techniques. The first involves coating the part with a commercially available silicone spray before sealing to PDMS via plasma treatment. In the second technique, the cured methacrylate resin is silanized with (3-Aminopropyl)triethoxysilane (APTES) before binding to PDMS with plasma treatment. Both methods create a strong seal between the two substrates, which is demonstrated with several types of microfluidic devices including droplet and gradient generators.
来源出处
Journal|[J]Analytica Chimica ActaVolume 1124, 2020. PP 78-84
DOI
https://doi.org/10.1016/j.aca.2020.05.014

PDMS臻品推荐

PDMS-微流控基质材料-PDMS/道康宁SYLGARD184-聚二甲基硅氧烷/0.5KG(组)

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信息更新:

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此链接为PDMS-微流控芯片/PDMS/道康宁SYLGARD184/小桶0.5KG装的链接。

一般性的产品性能参数表参考以下小桶装的参数:

微流控芯片/PDMS/道康宁SYLGARD184;微流控芯片/PDMS/道康宁SYLGARD184;微流控芯片/PDMS/道康宁SYLGARD184;

品牌型号:道康宁SYLGARD184

包装规格:0.5KG/罐[含有45.4g固化剂,总重量为0.5KG]

产品颜色:保质期限:36个月

存放环境说明:室温,阴凉处保存

备注说明:

美国道康宁道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品,包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合,中等粘度混合液的稠度与SAE 40机油相似。无论厚薄,混合液将固化成为具有韧性的透明弹性体,最适用于电子/电气方面的封装与灌封应用。 道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化,无放热现象,无需二次固化。固化过程完成后,可立即在-55~200℃的温度范围内使用。 产品特性:低毒性,在常规的工业操作中,无特别的注意事项; 无溶剂或固化副产物, 固化时不放热;无需特殊的通风条件,不会产生腐蚀;固化时,收缩量小; 固化后, 透明具有弹性;抗震与减缓机械震动;振动的传递性能小;元件可裸视检查与易修补性; 环保性能;低吸水性,良好的耐辐射性能;高真空状态下的低漏气性; 优异的电性能;较大温度范围内的稳定性, 抗解聚;在-55~200℃范围内,甚至在密闭状态下保持弹性与柔韧性,性能稳定; 阻燃性,UL可燃性分级为94 V-1,温度等级:130℃ 产品用途: 道康宁SYLGARD 184硅橡胶在电气/电子的封装与灌封方面有广泛的应用。