飞秒激光图形化互连用弹性体上金属薄膜的力学建模

ty10086 提交于 周三, 08/25/2021 - 15:55
文章英文标题
Mechanical modeling of metal thin films on elastomers for femtosecond laser patterned interconnects
正文
本工作中,我们对弹性体基底上沉积的Au / Ti薄膜,如聚二甲基硅氧烷( PDMS )与Kapton®上的样品进行了力学分析,沉积后的金属通过超短( 270飞秒)脉冲激光烧蚀进行了图形化。与先前演示的长脉冲激光图形相比,减少了对基板的热损伤,减少了热影响区。厚弹性体金属化过程中的一个主要问题是金属薄膜在金属化过程中形成皱纹并伴随脆性裂纹,恶化金属线的性能和可靠性。在聚酰亚胺上没有观察到这种开裂现象。用金属-弹性体系统的应力分析研究了裂纹的形成,假设当金属膜中的应力超过某一临界值时就会出现裂纹。提出了多层多材料叠层系统的一般力学模型和分析,并将其应用于PDMS上Au / Ti的特殊情况。利用该模型,已经考察了金属薄膜中应力发展的根本原因。采用Sylgard 184,Dow Corning PDMS制成的各种弹性体基底制备了一系列样品。在单体与交联剂质量比为1:2 ~ 1:19范围内,采用不同的单体/交联剂比例制备了一系列样品。利用薄膜应力分析,计算了不同层之间和层内的内应力。根据计算结果,可以估算金属薄膜中的比应力。利用这个值,我们可以选择合适的具体材料,不会超过它们的临界破坏应力。通过光学显微镜和扫描电子显微镜( SEM )二次电子( SE )图像的失效分析,验证了这一假设。我们在这里报告了力学分析预测与各种样品完整性之间的良好相关性。因此,利用该模型,我们可以定义一个“安全区”,即对于什么弹性模量和热膨胀系数( CTE )不存在“泥裂纹”缺陷。
文章内容(英文)
In this work, we present the mechanical analysis of thin Au/Ti film deposited on elastomer substrate, e.g. Polydimethylsiloxane (PDMS) comparing to samples on Kapton®. After deposition, the metal was patterned by ultrashort (270 femtosecond) pulse laser ablation. Minimizing the thermal damage to the substrate, reducing Heat Affected Zone (HAZ) compared to previously demonstrated laser patterning with longer pulses. One of the major issues in the metallization of thick elastomers is the formation of wrinkles followed by brittle cracks in the metallic thin film during the process, deteriorating the metal lines performance and reliability. Such cracking has not been observed on polyimide. The crack formation was investigated using stress analysis of the metallic-elastomeric system, assuming that cracking appears when the stress in the metal film is exceeding a critical value. A general mechanical model and analysis of a multilayer and multi-material laminated system is presented and applied to the specific case of Au/Ti on PDMS. Using this model, the root cause for the stress development in the metallic film has been investigated.A series of samples had been prepared using various elastomer substrates made of Sylgard 184, Dow Corning PDMS. A series of samples was prepared using different monomer/cross-linker ratios in the range of 1:2 to 1:19 monomer to cross-linker weight percentage ratio. Using the thin film stress analysis, the inner stress between and inside the different layers was calculated. Based on the calculations, we could estimate the specific stress in the metallic film. Using this value, we could choose the right specific materials that would not surpass their critical failure stress. This hypothesis was tested and verified by the failure analysis conducted by optical microscope and scanning electrons microscopy (SEM) secondary electrons (SE) images. We report here on a good correlation between the mechanical analysis predictions and the various samples integrity. Therefore, using that model, we could define a “safe zone”, i.e. for what elastic modulus and Coefficient of Thermal Expansion (CTE) there are no “mud-crack” defects.
来源出处
Journal|[J]Microelectronic Engineering2021. PP 111534-
DOI
https://doi.org/10.1016/J.MEE.2021.111534

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信息更新:

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备注说明:

美国道康宁道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品,包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合,中等粘度混合液的稠度与SAE 40机油相似。无论厚薄,混合液将固化成为具有韧性的透明弹性体,最适用于电子/电气方面的封装与灌封应用。 道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化,无放热现象,无需二次固化。固化过程完成后,可立即在-55~200℃的温度范围内使用。 产品特性:低毒性,在常规的工业操作中,无特别的注意事项; 无溶剂或固化副产物, 固化时不放热;无需特殊的通风条件,不会产生腐蚀;固化时,收缩量小; 固化后, 透明具有弹性;抗震与减缓机械震动;振动的传递性能小;元件可裸视检查与易修补性; 环保性能;低吸水性,良好的耐辐射性能;高真空状态下的低漏气性; 优异的电性能;较大温度范围内的稳定性, 抗解聚;在-55~200℃范围内,甚至在密闭状态下保持弹性与柔韧性,性能稳定; 阻燃性,UL可燃性分级为94 V-1,温度等级:130℃ 产品用途: 道康宁SYLGARD 184硅橡胶在电气/电子的封装与灌封方面有广泛的应用。