分析和提高扫描离子电导显微镜的ta移液管配置的定位可靠性和准确性。

ty10086 提交于 周三, 08/25/2021 - 15:58
文章英文标题
Analysis and improvement of positioning reliability and accuracy of theta pipette configuration for scanning ion conductance microscopy.
正文
扫描离子电导显微镜( SICM )作为一种新兴的非接触式扫描探针显微镜技术,以其对软、黏性样品的原位检测能力强等特点,越来越多地应用于生物医学和材料相关研究。在SICM测量中,用吸管作为SICM探针扫描样品是扩展SICM多参数测量应用的有效方法。影响SICM测量中ta移液器使用可靠性和准确性的关键问题有两个,即安全反馈阈值和水平测量偏移量。本文针对SICM的θ吸管结构,通过有限元模拟和SICM实验,系统地研究了θ吸管的两个问题。有限元分析结果表明,Theta移液管一侧桶的安全反馈阈值在99.5 %以上,水平测量偏移量为探头尖端内径的~ 0.53倍。基于此,我们提出了一种改进的扫描方法,用于解决由于反馈阈值过于接近参考电流( 100 % )以及针尖半径级的测量误差所带来的可靠性和准确性问题。然后用SICM的改进方法对不同压印花样的聚二甲基硅氧烷( PDMS )样品进行测试,可以得出改进方法通过增加双桶逼近过程增强扫描可靠性,通过补偿一个偏移距离提高定位精度。本文的理论分析和改进的扫描方式展示了更多的Theta移液器的性能和使用细节,进一步提高了Theta移液器在SICM中多样化多功能应用的可靠性和准确性,以满足日益复杂和精确的研究需求。
文章内容(英文)
Scanning ion conductance microscopy (SICM) as an emerging non-contact scanning probe microscopy technique and featuring its strong in-situ detectability for soft and viscous samples, is increasingly used in biomedical and materials related studies. In SICM measurements, employing theta pipette as SICM probe to scan sample is an effective method to extend the applications of SICM for multi-parameter measurement. There are two crucial but still unclear issues that influence the reliability and accuracy of the usage of theta pipette in the SICM measurements, which are the safe feedback threshold and the horizontal measurement offset. In this work, aiming at the theta pipette configuration of SICM, we systematically investigated the two issues of the theta pipette by both finite element method (FEM) simulation and SICM experiments. The FEM analysis results show that the safe feedback threshold of the one side barrel of the theta pipette is above 99.5%, and the horizontal measurement offset is ~0.53 times of the inner radius of the probe tip. Based on this, we proposed an improved scanning method used by the theta pipette to solve the reliability and accuracy problems caused by the feedback threshold too close to the reference current (100%) and the measurement offset error at the tip radius level. Then through testing the polydimethylsiloxane (PDMS) samples with different embossed patterns with the improved method of SICM, we can conclude that the improved method can enhance the scanning reliability by adding the double barrels approaching process and increase the positioning accuracy by compensating an offset distance. The theoretical analysis and the improved scanning method in this work demonstrate more property and usage details of the theta pipette, and further improve the reliability and accuracy of the diversified multifunctional applications of the theta pipette for SICM to meet the increasingly complex and precise research needs.S
来源出处
Journal|[J]UltramicroscopyVolume 224, 2021. PP 113240-113240
DOI
https://doi.org/10.1016/J.ULTRAMIC.2021.113240

PDMS臻品推荐

PDMS-微流控基质材料-PDMS/道康宁SYLGARD184-聚二甲基硅氧烷/0.5KG(组)

产品说明书PDF自助在线看:http://www.pdmshub.com/sih

信息更新:

美国总工厂生产的0.5KG原始包装的PDMS延期至2021年9月16日后才能交货,默认我们将发国内库存的进口分装产品(02085925-0.5KG);另受制于有机硅大幅涨价潮影响,2021年9月1日后将上调销售价格,另行通知。Dow Corning=道康宁=Dow SiL=陶氏,都是同一家公司。 2021.09.01更新

美国总工厂生产的0.5KG包装的PDMS恢复正常进口,合法正规,质量金标准,欢迎订购使用。并承诺从我司购买的皆为原厂包装,100%未开封,附带技术手册,非国产灌装仿制、非分装、非仿冒外包装产品,可以放心使用。大量订购更有优惠。2021.04.01更新

备注:由于dowsil与道康宁公司合并,美国总工厂生产的PDMS,价格涨幅高达1倍之多,因针对科研用户使用,特备货规格0.5KG。如果您需要美国总工厂原厂生产的大规格包装的预定,可以与QQ 11366508联系给予报价/货期。2021.05更新

此链接为PDMS-微流控芯片/PDMS/道康宁SYLGARD184/小桶0.5KG装的链接。

一般性的产品性能参数表参考以下小桶装的参数:

微流控芯片/PDMS/道康宁SYLGARD184;微流控芯片/PDMS/道康宁SYLGARD184;微流控芯片/PDMS/道康宁SYLGARD184;

品牌型号:道康宁SYLGARD184

包装规格:0.5KG/罐[含有45.4g固化剂,总重量为0.5KG]

产品颜色:保质期限:36个月

存放环境说明:室温,阴凉处保存

备注说明:

美国道康宁道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品,包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合,中等粘度混合液的稠度与SAE 40机油相似。无论厚薄,混合液将固化成为具有韧性的透明弹性体,最适用于电子/电气方面的封装与灌封应用。 道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化,无放热现象,无需二次固化。固化过程完成后,可立即在-55~200℃的温度范围内使用。 产品特性:低毒性,在常规的工业操作中,无特别的注意事项; 无溶剂或固化副产物, 固化时不放热;无需特殊的通风条件,不会产生腐蚀;固化时,收缩量小; 固化后, 透明具有弹性;抗震与减缓机械震动;振动的传递性能小;元件可裸视检查与易修补性; 环保性能;低吸水性,良好的耐辐射性能;高真空状态下的低漏气性; 优异的电性能;较大温度范围内的稳定性, 抗解聚;在-55~200℃范围内,甚至在密闭状态下保持弹性与柔韧性,性能稳定; 阻燃性,UL可燃性分级为94 V-1,温度等级:130℃ 产品用途: 道康宁SYLGARD 184硅橡胶在电气/电子的封装与灌封方面有广泛的应用。